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1 PAH8002EP - 2p product datasheet low power optical heart rate detection chip pixart imaging inc. pixart imaging inc. h ttp://www.pixart.com all rights reserved. any portion in this paper shall not be reproduced, copied, or transformed to any other forms without per mission. version 1. 3 | 2 5 sep 2017 | 31007 a en PAH8002EP: low power optical heart rate detection chip general description the PAH8002EP is a low power and high - performance cmos - process optical chip with three leds: two green and one infrared, and integrated dsp, targeted as a heart rate detection (hr d) chip . it is based on optical sensing technology that captures higher resolution image than the traditional photodiode. the images are then processed through our integrated dsp to attain processed ppg (photoplethysmogram) data for use in deducing heart r ate. key features ? heart rate detection function (hrd) ? sram buffer support ? integrated ultra - low power mode, while in sleep mode ? adjustable sleep rate control ? communication interface options ? i 2 c ? four - wire spi ? i 2 c interface up to 1 mbit/s ? spi interface up to 2 mbit/s ? hardware reset support ? integrated chip - on - board leds with wavelength of 525nm and 940nm applications ? heart rate monitor accessories ? wearables : smartwatch , wrist band *disclaimer: the pah800 2ep - 2p is not designed for usage in medical device. in a ddition, the data and information of heart rate measurement provided by this chip may not be completely accurate and may exceed heart rate tolerance as per the specification stated in the document due to different factors, such as interference with signal from external sources, incorrect wearing position and changes in weather conditions or user's body condition. pixart imaging inc. disclaims all liability arising from such inaccuracy and assumes no responsibility for the consequences of use of such data a nd information. key parameter s parameter value operating temperature, tj ( c) - 20 to +60 array size 1 pixel pixel size (m) 780 x 780 max frame rate (fps) 50k dynamic range (db) 70 supply voltage (v) vddm: 3.3 C 3.6 vdd_ledx: 3.3 C 3.6 vddio: 1. 6 2 C 3.6 analog: 2.8 digital: 1.8 power consumption (m w) @3.3v note: including led current, without i/o toggling, package only active: ? double injection type : 4.95 with one led 8.25 with two leds 0.165 with ir t ouch detection ? printing cover type : 5 .9 4 wit h two leds 0 . 165 with ir t ouch detection sleep: 0.0 8 heart rate measurement range (bpm) 30 - 2 4 0 package size (mm) 3.6 x 6.36 x 1.0 ordering information part number package type PAH8002EP - 2 p 22 - pin lga for any additional inquiries, please co ntact us at http://www.pixart.com/contact.asp
2 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. contents PAH8002EP: low power optical heart rate de tection chip ................................ ................................ ................................ ..... 1 general description ................................ ................................ ................................ ................................ ............................ 1 key features ................................ ................................ ................................ ................................ ................................ ....... 1 applications ................................ ................................ ................................ ................................ ................................ ........ 1 key parameters ................................ ................................ ................................ ................................ ................................ ... 1 ordering information ................................ ................................ ................................ ................................ .......................... 1 list of figures ................................ ................................ ................................ ................................ ................................ ........... 3 list of tables ................................ ................................ ................................ ................................ ................................ ............ 3 introduction ................................ ................................ ................................ ................................ ................................ . 5 1.1 overview ................................ ................................ ................................ ................................ ................................ . 5 1.2 terminology ................................ ................................ ................................ ................................ ............................ 5 1.3 signal description ................................ ................................ ................................ ................................ .................... 6 operating specifications ................................ ................................ ................................ ................................ .............. 8 2.1 absolute maximum ratings ................................ ................................ ................................ ................................ ..... 8 2.2 recommended operating conditions ................................ ................................ ................................ ..................... 8 2.3 thermal specifications ................................ ................................ ................................ ................................ ............ 9 2.4 dc characteristics ................................ ................................ ................................ ................................ .................... 9 2.5 ac characteristics ................................ ................................ ................................ ................................ .................. 10 mechanical specifications ................................ ................................ ................................ ................................ .......... 11 3.1 mechanical dimension ................................ ................................ ................................ ................................ .......... 11 3.2 package marking ................................ ................................ ................................ ................................ ................... 12 system level description ................................ ................................ ................................ ................................ ........... 13 4.1 system overview ................................ ................................ ................................ ................................ ................... 13 4.2 heart rate detection ................................ ................................ ................................ ................................ ............. 14 4.3 reference schematic ................................ ................................ ................................ ................................ ............. 16 4.4 design guidelines ................................ ................................ ................................ ................................ .................. 17 4.5 recommend gu ideline for pcb assembly ................................ ................................ ................................ ............. 20 4.6 package information ................................ ................................ ................................ ................................ ............. 21 4.7 ir touch detection ................................ ................................ ................................ ................................ ................ 23 registers ................................ ................................ ................................ ................................ ................................ .... 23 5.1 registers list ................................ ................................ ................................ ................................ .......................... 23 document revision history ................................ ................................ ................................ ................................ .................... 25
3 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. list of figures figure 1. functional block d iagram ................................ ................................ ................................ ................................ ......... 5 figure 2. pin configuration ................................ ................................ ................................ ................................ ...................... 6 figure 3. package outline diagram ................................ ................................ ................................ ................................ ........ 11 figure 4. package marking ................................ ................................ ................................ ................................ ..................... 12 figure 5. system design for app level ................................ ................................ ................................ ................................ ... 13 figure 6. syste m design for firmware level ................................ ................................ ................................ .......................... 14 figure 7. reference application circuit C double injection type ................................ ................................ ............................ 16 figure 8 reference application circuit C printing cover type ................................ ................................ ................................ .. 17 figure 9. recommended layout pcb ................................ ................................ ................................ ................................ ..... 18 figure 10. pcb layout guide ................................ ................................ ................................ ................................ ................. 19 figure 11. ir reflow soldering profile ................................ ................................ ................................ ................................ .... 20 figure 12. carrier tape drawing ................................ ................................ ................................ ................................ ............ 21 figure 13. unit orientation ................................ ................................ ................................ ................................ .................... 22 list of t ables table 1. signal pins desc ription ................................ ................................ ................................ ................................ ............... 6 table 2. absolute maximum ratings ................................ ................................ ................................ ................................ ........ 8 table 3. recommended operating conditions ................................ ................................ ................................ ........................ 8 table 4. th ermal specifications ................................ ................................ ................................ ................................ ............... 9 table 5. dc electrical specifications ................................ ................................ ................................ ................................ ........ 9 table 6. ac electrical specifications ................................ ................................ ................................ ................................ ....... 10 table 7 . c ode identification ................................ ................................ ................................ ................................ ................... 12 table 8. register bank0 ................................ ................................ ................................ ................................ .......................... 23 table 9. register bank1 ................................ ................................ ................................ ................................ .......................... 24 table 10. register bank2 ................................ ................................ ................................ ................................ ........................ 24
4 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc.
5 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. introduction 1.1 overview the PAH8002EP is a low power and high - performanc e cmos - process optical chip , targeted as a heart rate detection (hrd) chip . it is built - in with 2 green leds, 1 infra r ed led and integrated dsp it comes with two communication interfaces, which are i 2 c supporting up to 1 mbit/s and four - wire spi supporting up to 2 mbit/s. sram buffer of 832 bytes is supported for the power saving at the host. the figure 1 show s the architecture block diagram of the device. refer to the subsequent chapters for detailed infor mation on the functionality of the different interface blocks. note: throughout this document PAH8002EP low power optical cmos heart rate chip is referred to as the chip . figure 1 . functional block diag ram 1.2 terminology term description gnd ground bidir bi - directional ppg photoplethysmogram touch touch detection for wear on or wear off sw reset software reset by register pixel array timing g enerator pga + adc led d river signal p rocess sram fifo buffer led channel clock g enerator lo speed rc 32 khz hi speed rc 32 mhz power regulator output vddd : 1 . 8 v vdda : 2 . 8 v vbgp : 1 . 2 v input vddm : 3 . 3 - 3 . 6 v vddio : 1 . 62 C 3 . 6 v vdd _ led : 3 . 3 - 3 . 6 v int i 2 c spi ch 2 : green 525 nm ch 1 : green 525 nm ch 0 : ir 940 nm pah 8002 ep led 1 led 2 vddd reset led 0 vdda 28 vbgp vdday vdd _ led 1 vdd _ led 2 spi _ s clk _ i 2 c _ scl spi _ csn spi _ sdo spi _ i 2 c i / o i nterface s spi _ sdi _ i 2 c _ sda vddm reset _ n int vssa vssd vssled p o w e r g n d serial interface t e s t
6 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. 1.3 signal description figure 2 . pin configuration table 1 . signal pins description pin no. signal name type description functional group: power supplies 1 vdd_led01 input ir/green led anode . provide vddm supply voltage 2 vdday input analog circuit power regulator in put . connect to vdd a28 or provide 2.8v voltage 3 vdd a 28 output analog circuit power regulator output . must connect 1 f capacitor to gnd 4 vddd output digital circuit power regulator output. must connect 1f capacitor to gnd 5 vbgp output reference regulator output . must c onnect 0. 1 f capacitor to gnd 7 vddm input power supply (3.3 - 3.6v ) for internal power regulator 8 vssled gnd led ground 15 vssd gnd digital ground 19 vddio input i/o power supp ly ( 1.62 - 3.6 v ) 20 vssa g nd a nalog ground s 22 vdd_led2 input green led anode . provide vddm supply voltage functional group: interface 11 spi_sdi_i2c_sda bidir 4 - wire spi: data input i 2 c: data i n put - o ut put 12 spi_sdo output 4 - wire spi: d ata o utput 13 spi_csn input 4 - wire spi: c hip s elect. a ctive l ow 14 spi_sclk_i2c_scl i nput 4 - wire spi/ i 2 c: c lock
7 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. pin no. signal name type description functional group: functional i/o 16 int output data ready interrupt. default is edge sensitive interrupt, can be changed to level sensitive interrupt (high active) in int type register 17 spi_i2c input interface select ion i 2 c: pull down (tie to gnd ) 4 - wire spi: pull high (tie to vddio) 18 reset_n input hardware control to enter r eset m ode . connect to vddio when not used level high: leave reset mode level low: enter reset mode functional group: reserved 9 led0 rsv reserv ed for led0 test pin 6 led1 rsv reserved for led1 test pin 10 led2 rsv reserved for led2 test pin 21 nc rsv reserved. no connection
8 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. operating specifications 2.1 absolute maximum ratings table 2 . absolute maximum ratings parameters symbol min. ma x. unit notes analog voltage v ddm _max - 0.4 v dd m + 0.3 v i/o voltage v ddio_max - 0.4 v ddio + 0.3 v i/o pin input high voltage v ddio_ in - 0. 4 v ddio + 0.3 v all i/o pins relative humidity rh 0 50 % non - condensing, non - biased esd esd hbm 2 kv class 2 on all pins, as per human body model . jesd22 - a114e with 15 sec zap interval. notes: 1. at room temperature. 2. maximum ratings are those values beyond which damage to the device may occur. 3. exposure to these conditions or conditions beyond those indicated may adv ersely affect device reliability. 4. functional operation under absolute maximum - r ated conditions is not implied and should be restricted to the recommended operating conditions. 2.2 recommended operating conditions table 3 . recommended o perating conditions description symbol min. typ. max. unit notes a mbient temperature t a - 20 25 60 c operating junction temperature t j - 20 - 60 c power supply voltage v ddm 3. 25 3.3 3.6 v power regulator input supply. includes ripples analog supply voltage v dday 2.66 2.8 2.94 v if supply from external power regulator. includes ripples i / o supply voltage v ddio 1.62 1.8 3.6 v includes ripples power regulator output voltage v ddd 1.62 1.8 1.98 v for digital circuit. includes ripples v dda28 2.52 2.8 3.08 v for analog circuit to be connected to v dday . includes ripples v bgp 1.08 1.2 1.32 v for power regulator reference. includes ripples supply noise v npp - - 100 mv p - p p eak to peak within 10k C 80 mhz serial clock frequency sck_spi - - 2 mhz sck_ i 2 c - 400 1 1 000 2 khz 1. max value for fast mode 2. max value for fast mode plus note: pixart does not guarantee the performance if the operating temperature is beyond the specified limit .
9 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. 2.3 thermal specifications table 4 . thermal spe cifications parameters symbol min. typ. max. unit notes storage temperature t s - 25 - 125 c lead - free solder temperature t p - - 245 c refer to package handling information document 2.4 dc characteristics table 5 . dc electrical spe cifications parameters symbol min. typ. max. unit condition s peak power supply current i ddm_max - - 100 ma for v ddm i dday_max - - 10 ma for v dday peak i/o supply current i ddio_max - - 1 ma for v ddio output supply current i ddd_max - - 80 ma for v ddd output supply current i dda28_max - - 20 ma for v dda28 power consumption supply current @ sleep i ddpd - 25 75 ua for chip only w akeup by read register inrush current i inrush - - 60 ma with one green led supply current @ hrd ppg double injection typ e i ddhrd - 1. 2 - ma f or chip only, n o t including led current, without i 2 c interface i/o toggle led current i ddled - 0. 3 - ma 20 report/sec, led dac = 5 0ma , on yellow skin color with two green leds supply current @ hrd ppg double injection type i ddhrd - 1. 7 - ma f or chip only, n o t including led current, without i 2 c interface i/o toggle led current i ddled - 0. 8 - ma 20 report/sec, led dac = 5 0ma , on yellow skin color with two green leds supply current @ hrd ppg printing cover type i ddhrd - 0.6 - ma f or chip only, n o t including led current, without i 2 c interface i/o toggle led current i ddled - 1.2 ma 20 report/sec, led dac = 5 0ma , on yellow skin color with ir touch detection supply current @ touch detection mode i ddtouch 45 ua f or chip only, n o t in cluding led current, without i 2 c interface i/o toggle led current at touch i dd led - 5 - ua 3.8 report/sec, led dac = 5 0 ma , on yellow skin color
10 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. parameters symbol min. typ. max. unit condition s i/o input high voltage v ih 0.7* v ddio - - v input low voltage v il - - 0.3* v ddio v output high voltage v o h v ddio - 0.4 - v ddio + 0.4 v @i oh = 2 ma output low voltage v ol - 0.4 - 0. 4 v @i ol = 2 ma led sink current i led 40 50 60 ma @ led dac = 5 0ma led cathode voltage v led - 0.4 3.6 v notes: 1. electrical characteristics are defined under recommended operati ng conditions . 2. all the parameters are tested under operating condition s: v ddm = 3.3 v, v ddio = 1.8 and 3.3 v, t a = 25c 2.5 ac characteristics table 6 . ac electrical specifications parameters symbol min. typ. max. unit condition s power up from v dd t pu 2 00 3 0 0 4 0 0 ms from v dd to valid interface communication sdi/sdo read hold time t hold - 3 - us minimum hold time for valid data. address and data delay time t delay 2.75 us refer to serial interface section chip pulse interrupt widt h t int 0.00625 0.5 16 us default 0.5us, can be changed in int_pulse_width register rise and fall times: sdi/sdo t r , t f - 30 - ns c l = 30 pf hw reset time t reset 2 00 300 400 ms reset_n from low to high period note s : 1. electrical characteristics are defi ned under recommended operating conditions 2. all the parameters are tested under operating conditions: t a = 25c , v dd m = 3 . 3 v, v ddio = 3.3v for 3.3v io application and v ddio = 1.8 v for 1.8v io application.
11 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. mechanical specifications 3.1 mechanical dimension figure 3 . package outline diagram
12 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. 3.2 package marking refer to figure 4 . package marking for the code marking location on the device package. figure 4 . package marking table 7 . c ode identification marking description xxxx pixart date code
13 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. system level description 4.1 system overview this section describe s on how the chip being used to make up a complete system including the explanation on the 3 rd party compon ents and how they work with the chip . the pah8002 is based on cmos image chip technology. it is designed to meet the requirements as heart r ate m onitor a ccessories and wearables like smart watch or wrist band device. figure 5 illu strates a system design for app l evel diagram. the p rocessor is access ing ppg data from 800 2 chip , then pass it to app l evel . app l evel appl ies pixart provided algorithm library to determine the heart rate data and wa veform. figure 6 . system de sign for firmware level illustrates a system design for firmware level diagram. the p rocessor will also access ppg data from 800 2 chip , then p erform heart rate calculation with pixart algorithm library and send result to display or end device . pah8002 can be configur ed to generate different frame ra te settings up to 50k fps . figure 5 . system design for app level
14 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. figure 6 . system de sign for firmware level 4.2 heart rate detection h eart rate detection is an optical measurement technique that uses a light source and a detector to detect cardiovascular pulse wave that propagates through the body. the detected signal (pulse wave) called pho toplethysmography and it is known as ppg/ptg. the ppg signal reflects the blood movement in the vessel, which goes from the heart to the fingertips through the blood vessels in a wave - like motion. therefore, we can use this ppg signal to calculate heart ra te. this optical based technology could offer significant benefits in healthcare application as it is noninvasive, yet accurate and simple to use . 4.2.1 application s ? heart r ate detection in general healthcare (perfusion index : typ.1% ) ? ppg waveform
15 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. 4.2.2 heart ra te detection performance p arameters value unit conditions heart rate measurement range 30 - 2 4 0 bpm heart rate tolerance of root mean square (rms) 3 bpm @ room temperature for steady state: 0 km/hr. 5 bpm @ room temperature for motion state: 0 C 9 km/hr on the treadmill. response time 8 - 10 sec ond @ h eart r ate = 72/bpm notes : ? p ah 8002ep can provide heart rate measurement. however, it is not for medical device usage. ? for usage of heart rate detection chip on the wearable device that to be put on the wrist, finger or palm, ? the chip must be placed securely and in - contact with the skin surface as well as keeping it stable without any motion during measurement in acquiring accurate heart rate measurement. ? do n ot wear the device on the wrist bone . it should be wear on the higher position of, especially for those with a smaller wrist. ? chip s performance is optimized with good blood flow. it is recommended to have light exercise for a few minutes to increase your blood flow before turning on the hea rt rate monitor. ? on cold weather condition or user is having poor blood circulation (e.g.: cold hands, fingers and feet), the chip performance (heart rate accuracy) could be effected as the blood flow is slower in the measuring spot position. it is recomm ended to activate the heart rate monitor in indoor use. ? if the chip is having problem to read heart rate, may t ry to swap it on the other side of hand wrist to repeat the measurement. ? for continuous heart rate measurement, do m inimize hand movement and ext reme bending of the wrist.
16 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. 4.3 reference schematic 4.3.1 schematic design - double injection type figure 7 . reference application circuit C
17 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. 4.3.2 schematic design - printing cover type figure 8 re ference application circuit C 4.4 design guideline s 4.4.1 schematic design 1. vddm & vddio: 3.3v~3.6v ( for 3.3v system) 2. vddm: 3.3v~3.6v, vddio: 1.62v~1.98v ( for 1.8v system) 3. it is recommended to separate the power system for vddm to avoid power inte rference. 4. spi_sdi_i2c_sda and spi_sclk_i2c_scl pull high to vddio with resistor for i 2 c only 5. vddd, vdda28 must have 1 f and vbgp must have 0. 1 f capacitor connect ing to gnd and place close ly to 8002 . 6. the gnd1, gnd2 and gnd3 must be separate d and connected to pcb main gnd . 7. int pin is recommended to be connect ed to mcu hw int as data ready int for power saving . 8. ensure that the vddm and vddio s power noise should be under 100mv (with 0.1 f and 10 f capacitor) 9. tie spi _i2c pin to vddio for spi or tie to gnd for i 2 c . 10. at power on, vddm and vddio must be power ed on at the same time or vddio to be power ed on before vddm. when vddio to be power ed on before vddm, the host should prevent using the i 2 c interface ( that is c onnected with 8002) to switch on the ldo providing vddm voltage. 11. at power o ff, vddm and vddio must be power ed off at the same time or vddm to be power ed off first before vddio .
18 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. 4.4.2 recommend ed layout information of main board 4.4.2.1 pad dimension on pcb/fpc 1. pad size design: ? if use solder mask defined (smd), pad size is referred as solder mask opening size. ? if use non - solder mask defined (non - smd), pad size is referred a s copper metal size. 2. recommended dimension of pad is shown in below figure. the actual pad size design will need to consider components aside. ( refer to figure 9 . recommend ed layout pcb ). notes: all dimension is mm. figure 9 . recommend ed layout pcb 4.4.2.2 recommended stiffener type for fpc (flex) back \ side (at sensor package area) 1. if use fpc (flex) board, stiffener is required to be added onto the back of fpc ( flex) to enhance the flex strength. 2. recommended stiffener type: fr4 or stainless steel . 3. recommended stiffener thickness: minimum 0.4mm for fr4 type, minimum 0.15mm for stainless steel. 4.4.2.3 recommended use 0.1~0.12mm thickness stencil for smt process. 1. the stencil thickness selection will need to consider passive component size aside package. 2. in case of the package is surface mounted on fpcb (flexible printed circuit boards), the overall thickness of cover layer & adhesive layer is recommenced to be controlled under than 40 m.
19 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. 4.4.2.4 pcb layout guidelines the following guidelines can be refer to figure 10 . pcb layout guide . 1. capacitor 0.1 f and 1 f must be placed close to the chip package. 2. the gnd plane of gnd of vssa, vssd and vss led must be layout separately and connected to the pcbs main gnd. figure 10 . pcb layout guide
20 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. 4.5 recommend guideline for pcb assembly recommended vend o r and type for pb - free solder paste ? almit lfm - 48w tm - hp ? senju m705 - grn360 - k i r reflow soldering profile can be refer to figure 11 . ir reflow soldering profile . temperature profile is the most important control in reflow soldering. it must be fine - tuned to establish a robust process. the typical recommended ir reflow profile is: figure 11 . ir reflow soldering profile note: (1) average ramp - up rate (30 to preheat zone): 1.5~2.5 /sec (2) preheat zone: (2.1) temperature ramp from 170~200 (2.2) exposure time: 90 +/ - 30 sec (3) melting zone: (3.1) melting area temperature > 220 for at least 30~50sec (3.2) peak temperature: 245 ms level : ms level 3
21 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. 4.6 package information 4.6.1 carrier tape drawing figure 12 . carrier tape drawing
22 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. 4.6.2 un it orientation figure 13 . unit orientation the maximum capacity of one packing box for PAH8002EP \ 2p : one inner packing box = 2500 units note: the tape and reel packing with vacuum pack is 1year storage available @ 25 c , 50%rh
23 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. r egisters l ist table 8 . register bank 0 note: switch to register ba nk 0 by writing 0x00 to r eg - 0x7f address register name access default address register name access default 0x00 product _id_lb ro 0x02 0x6e ae_ch0_mid_hb r/w 0x00 0x01 product _id_hb r o 0x80 0x6f ae_ch0_max_lb r/w 0x f 0 0x0 2 version_id ro 0xdx 0x70 ae_ch0_max_hb r/w 0x00 0x0d ch0_man_et_lb r/w 0xc8 0x71 ae_ch0_min_lb r/w 0x 52 0x0e ch0_man_et_hb r/w 0x00 0x72 ae_ch0_min_hb r/w 0x00 0x0f ch 1 _man_et_lb r/w 0x a0 0x77 ae_ch0_outerbound_hi_lb r/w 0x00 0x10 ch 1 _man_et_hb r/w 0x 00 0x7 8 ae_ch0_outerbound_hi_ h b r/w 0x0 6 0x11 ch 2 _man_et_lb r/w 0x 7 8 0x79 ae_ch0_outerbound_ lo _lb r/w 0x00 0x12 ch 2 _man_et_hb r/w 0x00 0x7a ae_ch0_outerbound_lo_ h b r/w 0x0 2 0x16 ana_bg r/w 0x00 0x7b ae_ch0_innertarget_hi_ l b r/w 0x00 0x3b ch0_samp_num r /w 0x 32 0x7c ae_ch0_innertarget_hi_ h b r/w 0x0 5 0x3c ch 1 _samp_num r/w 0x 20 0x7d ae_ch0_innertarget_ lo _ l b r/w 0x00 0x3d ch 2 _samp_num r/w 0x 20 0x7e ae_ch0_innertarget_lo_ h b r/w 0x0 3 0x47 ch0_global_enh r/w 0x0 1 0x85 ae_led0_dac_min r/w 0x0 1 0x48 ch1_globa l_enh r/w 0x00 0x8e ae_led0_dac_enh r/w 0x0 1 0x49 ch 2 _global_enh r/w 0x00 0x8f ae_ch1_enh r/w 0x0 1 0x4a led0_sub_ e nh r/w 0x00 0x90 ae_ch1_mid_lb r/w 0x a0 0x4b led1_sub_e nh r/w 0x0 1 0x91 ae_ch1_mid_hb r/w 0x0 0 0x4c led2_sub_e nh r/w 0x0 1 0x92 ae_ch1_max_ lb r/w 0x f0 0x4d led_onoff_swap r/w 0x0 1 0x93 ae_ch1_max_hb r/w 0x0 0 0x50 normalized_mode _enl_1 r/w 0x00 0x94 ae_ch1_min_lb r/w 0x 52 0x5 1 normalized_mode _enl_2 r/w 0x00 0x95 ae_ch1_min_hb r/w 0x0 0 0x56 normalized_ right_shift r/w 0x0 7 0x9a ae_ch 1 _outerb ound_hi_lb r/w 0x0 0 0x5a touch_detect_enh r/w 0x00 0x9b ae_ch 1 _outerbound_hi_ h b r/w 0x0 6 0x5c touchdetection_upper_th_1 r/w 0x00 0x9c ae_ch 1 _outerbound_ lo _lb r/w 0x00 0x5d touchdetection_upper_th_2 r/w 0x0 2 0x9d ae_ch 1 _outerbound_lo_ h b r/w 0x0 2 0x5e to uchdetection_upper_th_3 r/w 0x00 0x9e ae_ch 1 _innertarget_hi_ l b r/w 0x00 0x5f touchdetection_upper_th_4 r/w 0x00 0x9f ae_ch 1 _innertarget_hi_ h b r/w 0x0 5 0x60 touchdetection_lower_th_1 r/w 0x 8 0 0xa0 ae_ch 1 _innertarget_ lo _ l b r/w 0x00 0x61 touchdetection_low er_th_2 r/w 0x00 0xa1 ae_ch 1 _innertarget_lo_ h b r/w 0x0 3 0x62 touchdetection_lower_th_3 r/w 0x00 0xa7 ae_led1_dac_min r/w 0x0 1 0x63 touchdetection_lower_th_4 r/w 0x00 0xb0 ae_led1_dac_enh r/w 0x0 1 0x64 touchdetection_count_th r/w 0x0 a 0xb1 ae_ch2_enh r/w 0x0 1 0x65 notouchdetection_count_th r/w 0x0a 0xb2 ae_ch2_mid_lb r/w 0x a0 0x6c ae_ch0_enh r/w 0x0 1 0xb3 ae_ch2_mid_hb r/w 0x0 0 0x6d ae_ch0_mid_lb r/w 0x a0 0xb4 ae_ch2_max_lb r/w 0x f0 0xb5 ae_ch2_max_hb r/w 0x0 0 0xc1 ae_ch 2 _innertarget_hi_ h b r/w 0x0 5 0 xb6 ae_ch2_min_lb r/w 0x 52 0xc2 ae_ch 2 _innertarget_ lo _ l b r/w 0x00
24 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. address register name access default address register name access default 0xb7 ae_ch2_min_hb r/w 0x0 0 0xc3 ae_ch 2 _innertarget_lo_ h b r/w 0x0 3 0xbc ae_ch 2 _outerbound_hi_lb r/w 0x0 0 0xc9 ae_led2_dac_min r/w 0x0 1 0xbd ae_ch 2 _outerbound_hi_ h b r/w 0x0 6 0xd2 ae_led2_d ac_enh r/w 0x0 1 0xbe ae_ch 2 _outerbound_ lo _lb r/w 0x00 0x de pgagain _sel r/w 0x0 1 0xbf ae_ch 2 _outerbound_lo_ h b r/w 0x0 2 0xe 1 sw_reset_n r/w 0x0 1 0xc0 ae_ch 2 _innertarget_hi_ l b r/w 0x00 0xe6 led_dac_change_flag_enh r/w 0x0 0 table 9 . register bank 1 note: switch to register ba nk 1 by writing 0x0 1 to reg - 0x7f address register name access default address register name access default 0x 7a bg_sub _enh r/w 0x00 0xbb led1_dac_code r/w 0x40 0x7c congain _sel r/w 0x00 0xbc led2_dac_code r/w 0 x40 0x80 ps_ctrl_enh r/w 0x0 1 0xc0 lpt_enh r/w 0x0 1 0xb4 led0_man_ enh r/w 0x00 0xc3 osc_enl r/w 0x00 0xb5 led 1 _man_ enh r/w 0x00 0xd5 timer_gen_enable r/w 0x00 0xb6 led 2 _man_ enh r/w 0x00 0xd6 timer_gen_period_lb r/w 0x 4 0 0xb7 led0_dac_enl r/w 0x00 0x d7 timer_gen_period_hb r/w 0x0 1 0xb8 led1_dac_enl r/w 0x00 0xe6 if_wakeup_interval_lb r/w 0x0 5 0xb9 led2_dac_enl r/w 0x00 0xe7 if_wakeup_interval_hb r/w 0x00 0xba led0_dac_code r/w 0x 40 0xea setfifo_rptnum r/w 0x0 3 table 10 . regi ster bank2 note: switch to register ba nk2 by writing 0x0 2 to reg - 0x7f address register name access default address register name access default 0x 25 int_ mode_sel r/w 0x00 0x83 readout_fifo_checksum_4 ro 0x00 0x29 int_output_en l r/w 0x01 0x8c int_sramfifo _overflow_clear r/w 0x00 0x 45 touch_flag ro 0x00 0x8d int_sramfifo_overflow_mask r/w 0x00 0x 73 int_reg_array ro 0x00 0x8e int_sramfifo_underflow_clear r/w 0x00 0x 74 int_sramfifo_dr_mask r/w 0x00 0x8f int_sramfifo_underflow_mask r/w 0x00 0x75 int_sramfi fo_dr_clear r/w 0x00 0xa0 ch0_exposure_time _lb r o 0x00 0x76 int_touchdet_mask r/w 0x00 0xa 1 ch0_exposure_time _hb r o 0x00 0x77 int_touchdet_clear r/w 0x00 0xa 2 ch 1 _exposure_time _lb r o 0x00 0x78 all_int_mask r/w 0x00 0xa 3 ch 1 _exposure_time _hb r o 0x00 0x7 a int_type r/w 0x0 1 0xa 4 ch 2 _exposure_time _lb r o 0x00 0x7b int_pulse_width r/w 0x0 8 0xa 5 ch 2 _exposure_time _hb r o 0x00 0x80 readout_fifo_checksum_1 ro 0x00 0xa6 led0 _dac_value r o 0x00 0x 81 readout_fifo_checksum_2 ro 0x00 0xa 7 led 1_dac_value r o 0x00 0x82 readout_fifo_checksum_3 ro 0x00 0xa 8 led 2_dac_value r o 0x00
25 version 1. 3 | 2 5 sep 2017 | 31007 a en pixart imaging inc. http://www.pixart.com all rights reserved. any portion in th is paper shall not be reproduced, copied, or transformed to any other forms without permission. PAH8002EP - 2p product datasheet low power optical hea rt rate detection chip pixart imaging inc. do cument revision history revision number date description 1. 0 1 4 apr 201 6 1 st creation 1.1 07 apr 201 7 modify pc cover current consumption for new design 1.2 23 aug 2017 update pad dimension on pcb/fpc 1.3 2 5 sep 2017 update recommend ed pcb layout

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